HILBOX FX

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HIGH PERFORMANCE FPGA ACCELERATOR FOR xPC VIRTUAL PROTOTYPING OF POWER ELECTRONIC SYSTEMS

Highlights:

• Integrated with SIMULINK RTW and xPC Target Software
• INTEL CORE2 dual-core and multiple XILINX FPGA processors
• 30/120-microsecond time step on x86 processors
• 250 nanosecond time step on XILINX FPGA processor
• User-programmable FPGA based reprogrammable IO systems
• Library of IGBT convertors and PMSM FPGA models
• Fast 16-bit converters and several signal conditioning modules
• Available in Terasoft Micro-Box compact PC104 chassis, and industrial WANDA BOX and
• HILBOX chassis

Description:
HILBOX FX integrates industrial computer systems running SIMULINK xPC Target Software via an FPGA-based interface. The interface is connected directly to DIO and fast 16-bit analog converter and signal conditioning modules. High speed FPGA-based IO can be controlled directly by SIMULINK models running between 120 and 150 microseconds on a standard PC processor. Complex models and signal processing functions can also be developed with SIMULINK and a XILINX System Generator and downloaded to an FPGA processor to execute models with time steps below 500 nanoseconds. A rich library of IO functions and power electronic drive with PMSM motor models is also available.
HILBOX FX can be configured as a rapid control prototyping system interfaced with physical hardware systems through the use of Opal-RT OP5000 IO and computer chassis to test control algorithms used in automotive, aerospace and industrial applications. An extensive array of available professional hardware and software components (listed below) enables HILBOX FX to be configured as a high-performance HIL simulation systems directly interfaced with pre-production electronic control units or RCP.

The following list of chassis, IO and software are compatible with HILBOX FX and with Opal-RT’s RT-LAB multi-processor simulators:

Industrial 4U WANDA BOX and HILBOX HIL computer and IO systems equipped with off-the-shelf CORE2 dual-core and quad-core computer boards integrated with standard IO and fast FPGA-based IO and signal conditioning boards. HILBOX can be equipped with up to 5 FPGA boards and 192 IO channels. One FPGA board can be installed in 4U WANDA BOX xPC systems. The capability to install multiple FPGA boards for xPC applications will be available in 2008.

Compact 3U WANDA BOX3 HIL and RCP computer and IO chassis integrating Core2 Duo standard boards.

MX STATION chassis can be equipped with up to 3 FPGA boards and 128 IO channels. Currently one FPGA board can be installed in MX STATION xPC systems. This capability will increase in 2008

Ruggedized Micro-Box PC104 systems from Terasoft Inc for field tests using xPC compatible OP5000 IO boards.

RT-EVENTS blockset compatible with SIMULINK to generate and capture events occurring between the main model time steps and to implement dynamic models having states changing based on external events, (Available Q1, 2008)

OP5110 FPGA boards for fast IO controls. I/O conditioning modules:

OP5330 – type B module with 16 500-nanos and 1 micros update 16-bit DA signal converters and signal conditioning with +- 16 V capability optimized for automotive, aerospace and industrial applications.

OP5340 – type B module with 16 16-bit independent AD signal converters, 2.5 micros total conversion time for all 16 channel converted simultaneously, 6.4 Mega Sample per s total sampling rate, true differential input signal conditioning adjustable from +- 1V to +- 100 V (+- 20V standard).

OP5311 and OP5312 opto-isolated digital output and input modules.

OP5237-X. 32 digital IO, up to 150V for relay and solenoid drive and high-voltage status sensors

OP5231 - 32 channels optical fiber interface board controlled by OP5110 and OP5130 FPGA

OP5236 - 16 LVDS Driver and 16 LVDS Receiver

OP5222 - OPXI Carrier for ONE Mezz Type B data converter module and Type C signal conditioning module.

OP5241 - Type C module with 4 isolated +/- 16V 200-mA analog output buffers and 12 (3x4) isolated +/- 16V 40mA analog output channels. (OP5222 and OP5330 DA module required)

OP5952-X-Module with 4 +/-18V (or +/-15) 420mA isolated DCDC power supply for OP5241

OP5511 - Module with four (4) 100-V to 600-V high-voltage differential probes and four (4) 5-A to 50-S magneto-resistive DC-50-kHz current sensors

OP5949 - monitoring and patch panels for 32 analog differential signals and 16/32 digital signal. It includes differential instrumentation amplifiers, status LED and single ended output for signal monitoring in order to not disturb differential sensor analog signals.

The following options, will be available in 2008

OP5130 XSG XILINX FPGA development system and board programmable by users with SIMULINK to implement fast motor models and signal processing functions.

OP5130 MultiXSG XILINX FPGA development system to interconnect several OP5130 FPGA boards on the same xPC ACCELERATOR systems

OP5110 SPI FPGA IP core and SIMULINK driver to interface with several type of ECUs.

OP5110 RPG Reference Pulse Generation FPGA IP core and SIMULINK driver to generate cam and crank signals for engine.

OP5411 1.25 Gbits/s optical fiber transmitter and receiver modules to interface with IO expansion chassis

XSGeDRIVE Library of ready-to-used IGBT converters and PMSM motor model executed on OP5130 FPGA boards with time step below 500 nanos and event stamping at 10 nanos.

ORCHESTRA xPC: Publish and Subscribe interface enabling the interconnection of several xPC RCP systems to complex mechanical and electrical plant models implemented with SimPowerSystems and multi-processor RT-LAB eDRIVEsim and eMEGAsim systems.

Industries and Tasks:

• Aerospace and Defense
• Automotive
• Industrial Automation and Machinery
• Engine and transmission HIL simulators
• ABS/ATC HIL simulators
• Automated transmission HIL simulators
• Full vehicle HIL simulators
• Satellite “Flat Sat” HIL simulators
• Electronic
• Semiconductor
• Robotics
• Rapid Control prototyping